The project

A small, working sensor board brings together a microcontroller, display connector, passives, and a battery holder. It gives us a concrete way to show the complete fabrication and assembly process.

The board uses an STM32 in a TSSOP-20 package with a 0.65 mm pin pitch, an e-ink FPC connector with a 0.50 mm contact pitch, and 0603 passives.

A measured workflow

Start with prepared Gerber files and components ready to place. The benchmark covers fabrication and assembly through flashing the firmware; it does not include circuit design, layout, or writing the firmware.

  1. PCB processing

    The laser processes the ceramic blank to form the board features.

    ≈10 min
  2. Stencil and solder paste

    Cut a tin stencil in place, apply solder paste, then peel off the stencil.

    ≈5 min
  3. Component placement

    Place the components by hand using tweezers.

    ≈10 min
  4. Reflow soldering

    Reflow the board on a small hot plate, then flash the firmware and check operation.

    ≈5 min

From the tray to working hardware

PCB processing at the workstation.
Manual component placement before reflow.
A finished PewCB board held beside the desktop machine

A short process video. The reported benchmark is specific to the Mini Weather Station.

What it demonstrates

Fine-pitch connectors and a working embedded system can be prototyped with a desktop fabrication workflow and manual assembly. The useful outcome is a board that can be powered, programmed, and tested.

For an engineering team, this makes it practical to evaluate a subsystem before committing it to the next product revision.

Project record

Published benchmark and process notes on EEVblog

PCB blank templates on GitHub